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Post-doc in simulations of thin film growth

Dübendorf
Atomic Layer Deposition International
EUR 90’000 pro Jahr
Inserat online seit: 15 April
Beschreibung

Post‑doc in Simulations of Thin Film Growth

Organisation: Empa, Department of Mechanics of Materials and Nanostructures, Thun, Switzerland.

Application Deadline: 30 June 2026 (UTC)

Job type: Temporary, Full‑time, 1‑year appointment (extendable up to 5 years).

Our laboratory is seeking a highly motivated researcher to conduct simulations of thin film growth.

Your tasks

* You will work on applied research and fundamental projects funded by InnoSuisse and the Swiss National Science Foundation, focusing on simulations of precursor transport, heat distribution, nucleation, and growth of thin films in atomic layer deposition (ALD) reactors.
* Simulations include finite element methods, Monte Carlo approaches, and continuum modelling.
* Verification of simulation results against experimental findings will be part of your activities.
* You are expected to publish research outcomes in high‑level peer‑reviewed scientific journals.

Your profile

* PhD in Physics, Chemistry, Material Science, Computational Science, or a related field.
* High motivation to collaborate with industry, experimentalists, and an international multidisciplinary research team.
* Experience in ALD and simulation techniques is desirable.
* Fluency in English (oral and written) required; knowledge of German or French is an advantage.
* 4‑10 years of research experience in Chemistry, Computer Science, Engineering, or Physics.

Our offer

* Work environment with state‑of‑the‑art equipment: cleanrooms, high‑level materials analysis facilities, ALD/MLD/PVD infrastructure, and advanced computing resources.
* Location: Thun, a beautiful area near the mountains in the German‑speaking part of Switzerland.
* Appointment starts August 2026, extendable up to 5 years, with potential for contract renewal.

We welcome all individuals who are interested in innovative, sustainable, and meaningful activities.

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