LIGENTEC is a young, dynamic and strongly growing company, headquartered in Lausanne, Switzerland, near EPFL, close to the shore of Lake Geneva. We are developing Photonic Integrated Circuits (PICs) to world‑leading performance with our customers for applications in Quantum Technologies, LiDAR, Space, Biosensors and more.
Senior Design Engineer
Key Responsibilities:
* Design & Layout Execution: Drive the design and layout of PICs, focusing on single-component optimization, circuit-level simulation, and achieving project objectives.
* Modeling & Analysis: Conduct circuit simulations for PICs going into products, analyse large datasets, and develop and implement custom models to close the gap towards first‑time right design.
* Design Infrastructure: Develop and maintain LIGENTEC’s layout library to ensure adherence to best layout practices and design‑for‑manufacturability (DFM).
* Design Flow Optimization and Efficiency: Proactively audit, analyse, and optimise the entire Design and Layout flow to identify critical bottlenecks, implementing strategic changes and automation to significantly reduce the design/layout cycle time across all team projects and ensure maximum engineering efficiency.
* Technical Planning: Responsible for project feasibility analysis and preparing clear, concise technical documentation and reporting.
* Work closely within cross‑functional teams (Process, Testing) to ensure successful PIC development.
* Provide technical guidance to junior engineers.
Qualifications and Requirements:
* MSc or PhD in Photonics or a related field.
* Minimum of 7+ years of hands‑on, industrial experience in integrated optics design and layout.
* A solutions‑oriented mindset, critical thinking abilities, and the capacity to thrive in a dynamic, shifting environment.
Expert proficiency in:
* Designing passive photonic components and circuits.
* Python programming and code versioning.
* Single components and large circuits layout (IPKISS tool knowledge is a plus).
Familiarity with:
* How PIC manufacturing affects design and layout (DFT/DFM).
* Active components design and heterogeneous integration.
* Developing custom analytic and semi‑analytic models.
* Expertise with PIC packaging is a plus.
* Collaborative team player, independent self‑starter, and excellent communicator (English proficiency required).
Benefits:
* A flexible and dynamic start‑up work environment.
* Be a member of an international, diverse, customer‑focused and highly motivated team.
* Personal responsibility in your job and the chance to grow with us.
* Our passion to bring PICs to everyday life.
We look forward to receiving your full application, including 1) your CV, 2) a statement of interest (relating the position to your skills), and 3) grade or work certificates. Incomplete applications may not be considered.
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