Overview As a member of the EMM-based team, he / she is tasked with wafer level and package level IC test program development, IC characterization and qualification testing in the BU Automotive.
Note: this role does not offer any remote work possibility
Responsibilities Generation of full wafer level and package level IC test programs for evaluation and production
Definition of IC test method and strategy.
Structured and organized approach to developing and verifying IC functions and specifications
Technical interface with EM design teams (local and remote)
Product engineering for assigned ICs
Support the BU technical leader in product test definition including technical analysis and test strategy
Interface with Quality, Design Services, Fab, Back-End
Interface with external customers when needed
Profile For this role, the following profile is requested :
Experience in all key aspects of digital and mixed signal IC test development at wafer and package levels, from test architecture definition to release to production testing
Solid background in test concepts for high volume automotive products
Experience in test hardware development and production tester functionality / operation.
C (or C++) and script programming skills for test systems
Strong motivation towards satisfying external customer requirements for automotive products
Professional requirements MS-level academic background, 5+ years of experience in relevant fields
Ability to communicate with clarity and precision when interacting with internal and external groups
Experience with Eagle ETS tester platforms
Prior experience in automotive IC products a plus
Languages English at C-level is required (orally and in writing), fluency in French a strong plus
Rue des Sors 3
Marin (Neuchatel)
Switzerland
Company address
EM Microelectronic-Marin Ltd
Rue des Sors 3
CH- Marin-Epagnier
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