A leading semiconductor assembly company based in Switzerland is seeking a Process Engineer to drive the development and optimization of high-precision Die Bonding systems. The ideal candidate will hold a Master’s or Bachelor’s degree in engineering, possess international experience, and have strong English skills. This role involves interdisciplinary collaboration, laboratory testing, and a focus on system optimization. Attractive benefits and a flexible working environment are offered, along with a market-related salary. #J-18808-Ljbffr