Challenges are our drive, innovation our calling. We at Kandou are a team of passionate accomplished professionals making a mark in the semiconductor industry. We're an innovative leader in high-speed and energy-efficient chip-chip link solutions critical to the evolution of the electronics industry, continuously developing to meet the demands of today's customers and tomorrow too. If you love to be part of a high-tech scale-up and are motivated by pushing your limits and challenging the status quo, we have an opportunity for you.
We are actively seeking a Package Design Engineer, based at either of our locations:
UK (Reading or East Kilbride/Scotland) or Switzerland (Lausanne) or Taiwan (Taipei)
Responsibility and Authority
* Complete all Package design activities within the given time frame as defined by the project deliverables.
* Complete Package design review processes with the Assembly subcons to ensure no design rule violations.
* Liaise closely with the respective IC layout Engineers during Package design phase.
* Complete verification of Electrical characteristics of the package and unit design using available SW Tools.
* Ensure cost effective methodologies are incorporated into Kandou's BGA substrate and LF designs (Multi Layer / Mechanical Drill / Plating Lines etc).
* Provide support, guidance and instructions to Assembly / Package related activities, questions and issues.
* Present detailed weekly reports of activities and progress to the cross-functional team.
* Work with multi-functional groups including product design, engineering and marketing to ensure our package design/technology requirements are fully supported by Kandou's assembly partners.
Required Competencies – Experience
* Minimum 5 years experience in IC Package Design using Cadence APD / SIP.
* Hands on experience using Cadence (Virtuoso / Extract IM / Power DC ) / Ansys SW Tools (SiWave / Q3D ) or similar tools.
* Experience using AutoCAD tool.
* Knowledge about various Electronic IC Packaging technology is a must.
* Basic understanding of Thermal and Mechanical behaviour of IC Packages.
* Basic understanding of IC physical layout is beneficial.
Required Competencies – Skills
* Proven top-level Package design and RLC extraction experience.
* Ability to perform package parasitics extraction.
* Strong task management & planning ability. Proficiency in estimating timescales for design completion.
* Able to work to tight and variable time scales
* Strong interpersonal and communication skills.
* Good networking, negotiation and influencing skills
* Adept at managing communication with assembly subcontractors.
If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It