About Corintis
Corintis offers innovative microfluidic cooling technologies for AI chips/GPUs and CPUs used in data centers. Working with many of the world's largest tech companies, our solutions improve compute sustainability and tackle the excessive electricity consumption associated with data center cooling, which consumes more electricity than New York and London combined. With our software platform, Glacierware, our customers or us adapt microfluidic channels to the powermap of their chip, and we manufacture these into cold plate solutions or provide solutions to enable the customer to embed these cooling channels inside the package/the chip. We were ranked as the No.1 Engineering startup in Switzerland for 2024.
Working at Corintis
Corintis offers a friendly and team-oriented workplace, bringing together over 50 people from over 25 nationalities to solve the most significant computing challenges of tomorrow. Based on the EPFL campus near Lausanne, we are closely connected to the local ecosystem and are located a few minutes walk from Lake Geneva.
Job Description
We are seeking a Vice President of Engineering to lead multiple engineering functions through our rapid scaling. This role will directly report to the CEO.
The goal of this role is to lead, manage, and mentor our engineering team leaders and provide top-level leadership of our day-to-day engineering activities, with a focus on the work done for our large customers. A key part of the role will also be representing the engineering organization externally to our customers.
Responsibilities
* Provide end-to-end leadership across multiple engineering teams and their sub-teams (Simulation, Mechanical design, testing, and NPI) for data center liquid cooling solutions. The two main objectives are:
o Ensure we deliver the best cooling solutions to our customers that meet their technical requirements.
o Improve how we design, qualify, and deliver cold plates to achieve better performance, reliability, and cost in a shorter time.
* Define and execute the engineering strategy in partnership with the leadership team.
* Ensure timely, high-quality execution for our major customer programs, including cold plate project delivery and thermal testing solutions.
* Hire, mentor, retain, and grow a strong layer of technical and people leaders across the organization.
* Provide technical guidance on architecture, design, and integration decisions.
* Represent the engineering function externally to customers and strategic partners.
* Ensure engineering decisions balance performance, reliability, cost, and manufacturability.
* Collaborate with the Manufacturing team to support our transition into mass production.
* Maintain a strong culture of technical excellence, ownership, and cross-functional collaboration.
* Define and track key performance indicators (KPIs) for engineering success, such as on-time delivery, system performance, manufacturing readiness, and customer satisfaction.
* Ensure compliance with relevant safety, regulatory, and quality standards.
* Promote best practices in systems engineering, documentation, and testing
Requirements:
* 10+ years of experience in advanced thermal management for semiconductors in data centers or HPC applications, with expertise in liquid cooling, cold plates, or IC packaging, including managing teams working on these topics.
* 10+ years of engineering leadership experience, including managing ICs and managers.
* Have been through multiple design and NPI cycles of direct-to-chip liquid cooling solutions for data center applications. Ideally, AI accelerator or GPU cooling solutions using PG25 coolant (or equivalent).
* Strong background in thermal/mechanical engineering, with solid understanding of performance metrics at the cold plate, server, and system level, including pressure drop, thermal resistance. The ideal candidate understands how design choices affect performance, cost, and reliability, and how to steer engineering decisions to achieve desired outcomes, and communicate this without ambiguity.
* Hands-on experience in testing chip and data center cooling systems, knowing how to interpret test data, and data sheets, and ensuring decisions are taken based on reliable data.
* Deep knowledge of high-volume metal manufacturing processes, including machining and bonding processes.
* Strong understanding of interdisciplinary engineering (e.g., thermal, fluidics, materials, packaging, mechanical, etc.). In particular, the ideal candidate knows the impact of materials on reliability, performance, and cost.
* Take end responsibility, ensuring deeply technical presentations to our customers are accurate and meet a very high standard in technical clarity and presentation quality. The ideal candidate knows how to communicate an idea and tell a story using data.
* Ability to work onsite in Lausanne, with occasional travel to the US and Asia.
* Exceptional written and spoken English communication skills.
This is a great fit if:
* You can lead, mentor, and grow a team as a leader while also jumping in to be hands-on with the team when needed.
* You thrive in a fast-paced environment with complex customer demands of the wider engineering teams that you manage, if the customer is scaling with us or has a problem this won’t be a typical 9-5 role.
* You have a high sense of urgency and care about getting stuff done.
* You genuinely care about delivering cooling solutions to delight customers and driving the future of data center cooling.
* You build bridges with other departments and are excited about sharing your knowledge.
This won’t be the right role for you if:
* You are looking for a hands-off leadership role in a more corporate environment.
* You lack existing engineering knowledge/expertise in our market segment.
* You care more about titles, politics, and optics than excellence and execution.
* You pretend to know more than you do to look smarter, instead of asking questions.
* If you are annoyed by people frequently asking you questions.
* You prioritize your personal/team’s success over the company's success.
Location: Lausanne, Switzerland, Minimum 80% in office.
Start date: ASAP #J-18808-Ljbffr