Ph3bResponsibilities: /b /h3 ul liDry etching of GaAs and InP based materials by ICP‑RIE /li liDry etching of dielectric materials and metals by (ICP‑) RIE /li liDeposition processes like PECVD and ALD for dielectrics, sputtering and evaporation for metals /li liThermal processes like curing, annealing, alloying, and oxidation /li liDrive continuous improvements of product performance, process control, yield, and cost efficiency /li liAnalyze and document results and share findings and information with stakeholders /li liDevelop and implement new processes in collaboration with RD /li liPrepare and maintain work instructions and train operators and engineers /li liCoordinate and support maintenance and unscheduled equipment repairs, daily troubleshooting /li liEngage with tool suppliers to address process requirements, evaluate upgrades or new equipment solutions, and qualify them for production /li /ul h3bQualifications and Skills: /b /h3 ul liTechnology based Master or PhD with focus on semiconductor processing /li liPractical experience in at least some topics like dry etching, thin film deposition, oxidation, curing, and other thermal processes /li liFamiliar with high volume semiconductor manufacturing processes /li liUnderstanding of SPC and DoE /li liAbility to work independently as well as to collaborate with operators, technicians and engineers /li liStrong verbal and written technical communication skills, preferably in German and English /li liResult oriented, hands‑on personality with initiative and a can‑do attitude /li /ul h3bBenefits: /b /h3 ul liA dynamic, international environment /li liAn appreciative, collegial corporate culture /li liUnique technical challenges for the products of the day after tomorrow /li liAbove‑average social benefits /li /ul /p #J-18808-Ljbffr