2 weeks ago Be among the first 25 applicants
Get AI-powered advice on this job and more exclusive features.
SWISSto12 is one of the world’s fastest-growing aerospace companies, evolving from its pioneering use of 3D printing technologies for high-performance Radio Frequency (RF) products and applications to manufacturing entire geostationary telecommunication satellites, called HummingSat, that define a new category in space and of which 4 have already been sold to international leading telecom operators: Intelsat and ViaSat (acqu. Inmarsat).
HummingSat is the world’s first commercial telecom GEO SmallSat developed in collaboration with the European Space Agency (ESA). Its uniquely compact size combined with highly capable telecom payloads allows telecommunications operators to deploy a cost-efficient, compact and agile asset without sacrificing performance or security.
SWISSto12 is also a leading provider of Radio-Frequency (RF) products and sub-systems. The company’s patented 3D printing technologies and associated product designs are unique to deliver lightweight, compact, highly performing, and competitive RF products. This position is a unique opportunity to lead the development of a new class of telecommunication satellites.
If you are looking for a position where you can play an active role in contributing to an innovative and fast-growing company, this role is for you.
Job Requirements
* Proficient in creating robust, DFM/DFT-compliant, PCB designs and optimized layouts while ensuring signal integrity.
* Hands-on experience with various thermal solutions including via farms, thermal vias, and heat sinks.
* Skilled in generating all necessary outputs from PCB fabrication to PCB assembly.
* Experienced in performing trade-off analyses to evaluate and select optimal design solutions.
* Collaborates with PCB/PCBA teams to reduce solution costs by simplifying stack-up, via placement, and design complexity.
* Strong team player, working closely with multidisciplinary teams including RF, DC, Digital, Power Amplifier, Quality Assurance (QA), and MAIT teams.
* Proven experience designing complex PCBs (> than 10 layers, μvias, stacked vias, etc.).
* Proficient using Altium and/or Cadence.
* Hands-on experience with mixed-signal, intermediate frequency (IF), and high-frequency design.
* Experience with multi-material PCB design is a plus.
* Extensive experience implementing manufacturing rules from various manufacturers.
* Proactive in design troubleshooting and iterative problem-solving within cross-functional teams.
* Prior experience in design validation and lab-based troubleshooting using test equipment is not required but considered an asset.
* Demonstrates passion for engineering and a strong commitment to technology-driven work.
* IPC standards knowledge is strongly recommended.
* Previous experience in Space grade PCBs is also plus.
Job Responsibilities
* Design and development of PCB layout for mixed use of Radio Frequency, High Speed Digital, and Analog Circuitry.
* Provide all manufacturing outputs for Bare board and PCBA build prototypes and mass production.
* Interface with Mechanical Design (Solidworks) to ensure clash-free component to enclosure live 3D checking.
* Work Closely with RF and Digital hardware Engineers on the Design Implementation and RF Requirements.
* Participate on Peer Reviews with Engineering team including PCB and Assembly Houses.
* Perform Hands-on PCB Design Verification Tests and Troubleshooting using Oscilloscope & Lab Equipements.
* Develop In-depth knowledge in the construction and manufacture of micro-via, and conventional structures/technologies for multi-layer SM/PTH Printed Circuit Boards.
* Develop internal manufacturing guidelines to share with engineering team.
* Construction and Maintenance of Libraries and Databases of PCB 2D and 3D components.
* Maintenance of PCB Design CAD System, licenses, updates.
To be chatted during your exchange with our recruitment team.
More about SWISSto12:
SWISSto12 has successfully established contracts with ViaSat (acqu. Inmarsat), Intelsat and ESA for HummingSat as well as contracts for its RF product line in Europe and the USA with prominent partners and customers such as Thales, Lockheed Martin, Northrop Grumman and ESA. SWISSto12 is a spin off from the Swiss Federal Institute of Technology in Lausanne (EPFL), is privately owned and backed by prominent Swiss and European Investors. SWISSto12 is headquartered in Renens (close to Lausanne, Switzerland), and operates subsidiaries in Foster City California USA, Virginia USA, Madrid Spain and Copenhagen Denmark. The company is well funded for its developments and backed by a solid customer revenue stream with near term profitability.
Seniority level
* Seniority level
Entry level
Employment type
* Employment type
Full-time
Job function
* Industries
Defense and Space Manufacturing, Aviation and Aerospace Component Manufacturing, and Telecommunications
Referrals increase your chances of interviewing at SWISSto12 by 2x
Sign in to set job alerts for “Printed Circuit Board Designer” roles.
Principal Photonics Manufacturing Engineer
Senior Scientist / Postdoctoral Fellow Position in Low-Power Semiconductor Devices and Integrated Sensors for Edge AI
Neural Interface Hardware Postdoctoral Position : Electrical and Micro Engineering and Neuro-X, EPFL
Postdoctoral Researcher on Short-Term Wind and Solar Power Forecasting
Electrical Ground Support Equipment (EGSE) Engineer
We’re unlocking community knowledge in a new way. Experts add insights directly into each article, started with the help of AI.
#J-18808-Ljbffr