Packaging Design Engineer – IC Resources
My client is looking for a Package Design Engineer to be based in Switzerland. This is for a cutting‑edge, semiconductor company, ideal for someone wishing to join a high‑tech scale‑up.
Responsibilities
* Complete and review the package design requirements in line with project quotas and design rules
* Validate the electrical characteristics of the Package
* Implement specific cost‑saving techniques in client Package designs
* Communicate and collaborate with teams cross‑functionally with regards to Package design
Must Haves
* Minimum 5 years of experience in IC Package Design
* Strong knowledge of Electronic IC Packaging technology, including Thermal and Mechanical
* IC Package design experience of the overall structure, and RLC extraction
* Can use relevant software e.g. Cadence/Ansys and AutoCAD tool
Good to Have
* Understanding of IC physical layout
* Strong communication, organisation and interpersonal skills
* Proficient in liaising with external assembly vendors
If you want to excel your career in a fast growing company, contact Ella Flynn @IC Resources.
Seniority Level
Mid‑Senior level
Employment Type
Full‑time
Job Function
Engineering and Information Technology
Industries
Staffing and Recruiting
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