Expleo is a global engineering, technology, and consulting partner helping businesses innovate, transform, and deliver high‑quality products and solutions. With expertise spanning aerospace, automotive, transportation, telecommunications, financial services, and life sciences, we support clients in solving complex engineering challenges while accelerating innovation. Our teams combine deep technical knowledge with a hands‑on mindset, working collaboratively to drive measurable impact and operational excellence.
Expleo is seeking a Senior Mechanical Engineer to support the development of advanced aerospace hardware systems. In this role, you will own the full mechanical development lifecycle of complex, highly integrated products designed for harsh airborne environments.
You will work closely with multidisciplinary engineering teams (systems, electrical, RF, and manufacturing) to design, simulate, test, and industrialize mechanical sub‑systems that meet strict performance, size, weight, and reliability requirements.
This role is suited to a senior‑level engineer who combines strong theoretical expertise with hands‑on lab and manufacturing experience.
Responsibilities
* Take full ownership of the mechanical development lifecycle of advanced antenna systems, from requirements definition to final validation.
* Lead system architecture design, including technical trade-offs and multidisciplinary integration.
* Define and structure work packages, follow execution, and support project management in planning, interface coordination, and risk mitigation.
* Design, simulate, prototype, and test complex, highly integrated mechanical systems and components.
* Work closely with industrial partners, and testing facilities to ensure robust product development.
Qualifications
* Degree in Mechanical Engineering (Bachelor’s or Master’s) or equivalent experience.
* Minimum 10 years of experience in mechanical engineering within a relevant industry.
* Strong proficiency with CAD tools (e.g., SolidWorks) and data management systems (e.g., EPDM).
* Solid background in thermal simulations and thermal management solutions.
* Experience in system‑level design involving mechanical, electrical, RF, or optical considerations.
* Expertise in ruggedized/embedded packaging for harsh environments (e.g., aerospace).
* Knowledge of Design for Manufacturing, Assembly, Testing, and Maintenance principles.
Desired Skills
* Experience in co‑design with electronic teams (e.g., Altium365).
* Skills in parametric design and rapid concept development.
* Familiarity with simulation tools such as Ansys Mechanical, Discovery, Icepack, or Mathcad.
* Knowledge of electronic cooling solutions.
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