Job description
As a member of the EMM-based team, he/she is tasked with wafer level and package level IC test program development, IC characterization and qualification testing in the BU Automotive.
Note: this role does not offer any remote work possibility
Key responsibilities include, but are not limited to:
1. Generation of full wafer level and package level IC test programs for evaluation and production
2. Definition of IC test method and strategy.
3. Structured and organized approach to developing and verifying IC functions and specifications
4. Technical interface with EM design teams (local and remote)
5. Product engineering for assigned ICs
6. Support the BU technical leader in product test definition including technical analysis and test strategy
7. Interface with Quality, Design Services, Fab, Back-End
8. Interface with external customers when needed
Profile
For this role, the following profile is requested:
9. Experience in all key aspects of digital and mixed signal IC test development at wafer and package levels, from test architecture definition to release to production testing
10. Solid background in test concepts for high volume automotive products
11. Experience in test hardware development and production tester functionality/operation.
12. C (or C++) and script programming skills for test systems
13. Strong motivation towards satisfying external customer requirements for automotive products
Professional requirements
14. MS-level academic background, 5+ years of experience in relevant fields
15. Ability to communicate with clarity and precision when interacting with internal and external groups
16. Experience with Eagle ETS tester platforms
17. Prior experience in automotive IC products a plus
Languages
18. English at C-level is required (orally and in writing), fluency in French a strong plus
Rue des Sors 3
Marin (Neuchatel)
Switzerland
Company address
EM Microelectronic-Marin Ltd
Rue des Sors 3
CH- Marin-Epagnier
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