Responsibilities:
* Dry etching of GaAs and InP based materials by ICP‑RIE
* Dry etching of dielectric materials and metals by (ICP‑) RIE
* Deposition processes like PECVD and ALD for dielectrics, sputtering and evaporation for metals
* Thermal processes like curing, annealing, alloying, and oxidation
* Drive continuous improvements of product performance, process control, yield, and cost efficiency
* Analyze and document results and share findings and information with stakeholders
* Develop and implement new processes in collaboration with R&D
* Prepare and maintain work instructions and train operators and engineers
* Coordinate and support maintenance and unscheduled equipment repairs, daily troubleshooting
* Engage with tool suppliers to address process requirements, evaluate upgrades or new equipment solutions, and qualify them for production
Qualifications and Skills:
* Technology based Master or PhD with focus on semiconductor processing
* Practical experience in at least some topics like dry etching, thin film deposition, oxidation, curing, and other thermal processes
* Familiar with high volume semiconductor manufacturing processes
* Understanding of SPC and DoE
* Ability to work independently as well as to collaborate with operators, technicians and engineers
* Strong verbal and written technical communication skills, preferably in German and English
* Result oriented, hands‑on personality with initiative and a can‑do attitude
Benefits:
* A dynamic, international environment
* An appreciative, collegial corporate culture
* Unique technical challenges for the products of the day after tomorrow
* Above‑average social benefits
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