Overview
As a member of the EMM-based team, he / she is tasked with wafer level and package level IC test program development, IC characterization and qualification testing in the BU Automotive.
Note: this role does not offer any remote work possibility
Responsibilities
* Generation of full wafer level and package level IC test programs for evaluation and production
* Definition of IC test method and strategy.
* Structured and organized approach to developing and verifying IC functions and specifications
* Technical interface with EM design teams (local and remote)
* Product engineering for assigned ICs
* Support the BU technical leader in product test definition including technical analysis and test strategy
* Interface with Quality, Design Services, Fab, Back-End
* Interface with external customers when needed
Profile
For this role, the following profile is requested :
* Experience in all key aspects of digital and mixed signal IC test development at wafer and package levels, from test architecture definition to release to production testing
* Solid background in test concepts for high volume automotive products
* Experience in test hardware development and production tester functionality / operation.
* C (or C++) and script programming skills for test systems
* Strong motivation towards satisfying external customer requirements for automotive products
Professional requirements
* MS-level academic background, 5+ years of experience in relevant fields
* Ability to communicate with clarity and precision when interacting with internal and external groups
* Experience with Eagle ETS tester platforms
* Prior experience in automotive IC products a plus
Languages
* English at C-level is required (orally and in writing), fluency in French a strong plus
Rue des Sors 3
Marin (Neuchatel)
Switzerland
Company address
EM Microelectronic-Marin Ltd
Rue des Sors 3
CH- Marin-Epagnier
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