Internship at swiss pic 2026

Swiss Photonics Integration Center (Swiss PIC) provides precision assembly and characterization solutions for Swiss industry, especially start‑ups and SMEs. High‑speed systems are widely demanded in optical communications, sensing, quantum computing, and testing and qualification are crucial steps to verify product performance. The center, located in Switzerland Innovation Park InnovAARE next to the Paul Scherrer Institute (PSI), invests in qualified industrialized processes, clean environmentally controlled fabs, high‑tech machinery, and has built a full production line for optical and electrical precision assembly.

The Opportunity

We are seeking an intern to contribute to photonic packaging and testing services for a minimum duration of 4 months. If you are experienced in Optical and/or RF characterization and packaging or familiar with related lab equipment, you are highly encouraged to apply, otherwise an openness to learn and readiness to tackle the task at hand while learning from experienced specialists is a must. Join our international and dynamic team of experts dedicated to pushing the boundaries of what is possible in photonics and shaping the future of technologies within communication, computing, quantum and beyond.

Tasks

• Systematic test and iteration on interface designs, using state‑of‑the‑art tools and methodologies to extract best designs for high‑frequency interfacing
• Characterise and qualify the developed solutions and produce technical documentation of the results
• Closely collaborate with the design and process engineering teams to develop and improve solutions that meet performance requirements and manufacturing constraints
• Clear and timely reporting to Swiss PIC experts

Requirements

• Bachelor, master, or PhD in Electrical Engineering, Physics, or a related field
• Hands‑on experience with optical or RF characterization equipment such as tunable lasers, OSAs, power meters, vector network analyzers (VNAs) or Lightwave component analyzers (LCAs) is a plus
• Experience with chip facet polishing tools is a plus
• Technical documentation skills and systematic reporting. Self‑motivated and able to work independently
• Strong analytical and problem‑solving skills, with the ability to troubleshoot complex issues and propose effective solutions
• Experience with semiconductor packaging, microelectronics or micromechanics is a plus
• Solid communication skills in English required

Benefits

• Opportunity to work on groundbreaking technology at the forefront of the industry, shaping the future of communication and computing
• International, collaborative and inclusive team culture that values creativity, diversity, and continuous learning
• Personal responsibility in your job and the chance to grow with us
• Our passion to bring PICs to everyday life

Employment rate: 60% or by arrangement. Place of work: Villigen, Switzerland. Start date: from June 2026. Duration: at least 4 months.