Job description
As a member of the EMM-based team, he/she is tasked with wafer level and package level IC test program development, IC characterization and qualification testing in the BU Automotive.
Note: this role does not offer any remote work possibility
Key responsibilities include, but are not limited to:
1. Generation of full wafer level and package level IC test programs for evaluation and production
2. Definition of IC test method and strategy.
3. Structured and organized approach to developing and verifying IC functions and specifications
4. Technical interface with EM design teams (local and remote)
5. Product engineering for assigned ICs
6. Support the BU technical leader in product test definition including technical analysis and test strategy
7. Interface with Quality, Design Services, Fab, Back-End
8. Interface with external customers when needed