Enabler for smaller, more powerful, and more energy-efficient microchips
Working for tomorrow today.
Around 80 percent of all microchips worldwide are produced using ZEISS technologies. As the centerpiece of every electronically controlled system, they have become an integral part of our everyday lives – whether in smartphones, smart homes or smart factories. ZEISS is a technology leader in the field of semiconductor manufacturing equipment. With high-precision lithography optics, photomask systems and process control solutions, ZEISS enables the production of ever smaller, increasingly powerful, and more energy-efficient microchips, and thus plays a pivotal role in the age of micro- and nanoelectronics.
Join our Research and Development department "Analysis and Data Science": We are responsible for the conceptualization, analysis, and realization of highly precise mechatronic systems for optical assemblies, specialized test stands and measurement equipment, handling, transport & testing processes, and integration processes. As part of the design process, we develop kinematic concepts, simulate and analyze their performance, create technical drawings and documentation. We use state of the art analysis and programming tools and IT architecture. Does this sound exciting to you? Then join our team at the Zurich location and take on the following exciting tasks:
Your Role You will work in a highly international team consisting of currently 12 members. Together, you will address ongoing problem formulations and conduct a variety of analyses for new developments and product improvements. You will have access to a wide range of tools and benefit from innovative working methods (agile, sprints, peer reviews, etc.).
Development of mechanical parts and components in close collaboration with design engineers
Advising and providing direction on improvements within projects and supporting the creation of new proposals for future projects
Optimization of mechanical systems with regard to stiffness, strength, stability, and thermal and thermoelastic behavior
Responsibility for structural and thermal analysis of assemblies and systems
Independent development of solutions and concepts in accordance with given and self-derived specifications
Preparation, review, and documentation of mathematical models for analyzed mechanisms and structures
Development of new methods for analysis, data processing, and evaluation as required
Evaluation of test results and correlation with models
Preparation of documentation in scientific English
Your Profile University graduate with a degree in Mechanical Engineering, Mechatronics, Robotics, or Aerospace Engineering
Initial experience working on development projects for high-precision actuators and machinery as well as a profound understanding of kinematics, mechanical systems, and structural analysis
Very good knowledge of the analysis tools Nastran and Altair Hyperworks Suite, including experience in advanced methods such as condensed models and state space representation
Good knowledge in thermal analysis using Ansys or Simcenter/TMG as well as of programming languages (Python, git) and MATLAB/Simulink with related toolboxes
English proficiency at C1 level (all technical discussions will be conducted in English); German language skills are desirable
Readiness to work on-site minimum 60% of the time, for the remainder remote work is possible
Your ZEISS Recruiting Team:
Katharina Eymann
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